Materials
Chip Based Materials
Wafer
- Si wafer
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- Substrate size: up to 8 inch (Grade: Dummy, Test, Prime)
- Orientation : (100), (110), (111)
- Thickness: 100 - 1000 um
- Glass wafer
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- Substrate size: up to 8 inch
- Type: Borofloat33, Eagle XG, Quartz, Fused Silica
- Plastic substrate
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- Type: PI, COC, PMMA, PS, PDMS etc.,
- Other wafers
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- Type: ITO wafer, SOG wafer, SOI wafer, LN wafer etc.
Materials for photolithography
- Photoresist
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- AZ series: GXR601,4330, 5214E, nLoF, 9260 etc.,
- SU series : 2002, 2005, 2010, 2025, 2050, 2100 etc.,
- AR-N series : 4400-10, 4400-25, 4400-50 etc.,
- Others: PI series, JSR(THB 151N), DL 1000 etc.,
Materials for process
- Developers: AZ MIF 300, AZ 400K , SU-8 Developer, JSR Developer etc.,
- Etching Solution : TMAH, KOH, Au etchant, CR-7, Al etchant etc.,
- Electroplating solution: Ni
- Other solution : Lift off solution