Materials

Chip Based Materials

Wafer
Si wafer
  • Substrate size: up to 8 inch (Grade: Dummy, Test, Prime)
  • Orientation : (100), (110), (111)
  • Thickness: 100 - 1000 um
Glass wafer
  • Substrate size: up to 8 inch
  • Type: Borofloat33, Eagle XG, Quartz, Fused Silica
Plastic substrate
  • Type: PI, COC, PMMA, PS, PDMS etc.,
Other wafers
  • Type: ITO wafer, SOG wafer, SOI wafer, LN wafer etc.
Materials for photolithography
Photoresist
  • AZ series: GXR601,4330, 5214E, nLoF, 9260 etc.,
  • SU series : 2002, 2005, 2010, 2025, 2050, 2100 etc.,
  • AR-N series : 4400-10, 4400-25, 4400-50 etc., 
  • Others: PI series, JSR(THB 151N), DL 1000 etc.,
Materials for process
  • Developers: AZ MIF 300, AZ 400K , SU-8 Developer, JSR Developer etc.,
  • Etching Solution : TMAH, KOH, Au etchant, CR-7, Al etchant etc.,
  • Electroplating solution: Ni
  • Other solution : Lift off solution